大型硅晶片平面度精密纳米计量技术

描述了一种基于斜率传感器的大型硅晶片平面度扫描测量系统．采用二维斜率传感器对晶片表面扫描，以获得表面绕X和Y轴的倾斜度．斜率传感器装在X向滑板上，而晶片固定在可绕Z轴转动的主轴上．对斜率传感器Y向的输出积分，得到晶片表面各个同心圆上轮廓截面高度．对斜率传感器X向的输出积分，得到晶片表面沿X向的截面轮廓，从而获得各同心圆轮廓之间的关系．构建了一个包括基于自准直原理的小型斜率传感器、气浮主轴、气浮导轨的实验系统，提出一种斜率传感器现场标定方法，用此系统测量了直径300mm的硅晶片平面度。

Precision Nanometrology of Large Silicon Wafer Flatness

This paper describes a slope sensor-based scanning system for flatness measurement of large silicon wafers. A two-directional (2-D) slope sensor is used to scan the wafer surface to get 2-D local slopes of the surface about the X- and Y-axes. The slope sensor is mounted on a linear X-carriage and the wafer on a spindle with its rotational axis along the Z-axis. Sectional height profiles of the wafer surface along concentric circles can be obtained from the integration of the Y-outputs of the slope sensor. A sectional profile along the .X-axis is obtained from integrating the X-outputs of the slope sensor so that the relationship between the profiles along the concentric circles can be determined. An experimental system, which consists of a compact slope sensor based on laser autocollimation, an air-spindle and an air-slide, is constructed. An in-situ calibration method for the slope sensor is also proposed. The flatness of a large silicon wafer with a diameter of 300 mm is measured in the system.