| 化学镀镍金在印制电路板制造中的应用 |
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| 引用本文： | 杨维生.化学镀镍金在印制电路板制造中的应用[J].化工新型材料,2002,30(2):24-26. |
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| 作者姓名： | 杨维生 |
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| 作者单位： | 南京第十四研究所,江苏,210013 |
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| 摘 要： | 本文简单介绍了印制板化学镀镍金工艺 ,对化学镀镍金的工艺流程、可焊性控制和化学镀镍金与其他表面镀镍金工艺的区别进行了较为详细的论述
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| 关 键 词： | 化学镀镍金 印制电路板 可焊性控制 |
| 修稿时间： | 2001年11月9日 |
Application of electroless nickel and immersion gold in the manufacturing of the printed circuit board |
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| Yang Weisheng.Application of electroless nickel and immersion gold in the manufacturing of the printed circuit board[J].New Chemical Materials,2002,30(2):24-26. |
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| Authors: | Yang Weisheng |
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| Abstract: | The technology of electroless nickel and immersion gold of the printed circuit board was brietly introduced.The process,solderability control of electroless nickel and immersion gold were illuminated.The difference between the electroless nickel and immersion gold with other surface nickel gold plating were also detailed. |
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| Keywords: | electroless nickel and immersion gold printed circuit board solderabililty control |
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