Substrate Dissolution and Shear Properties of the Joints between Bi-Ag Alloys and Cu Substrates for High-Temperature Soldering Applications |
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Authors: | Jenn-Ming Song Hsin-Yi Chuang Zong-Mou Wu |
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Affiliation: | (1) Department of Materials Science and Engineering, National Dong Hwa University, Hualien, 974, Taiwan |
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Abstract: | The present study investigated interfacial reactions between Cu substrates and Bi-Ag alloys during soldering. Without forming
intermetallic compounds (IMCs), the molten solder grooved and further penetrated along the grain boundaries (GBs) of the Cu
substrate. An increase in Ag content enhanced GB grooving, raised the dissolution rate and also the amount of dissolved Cu
in molten Bi. A stoichiometric Cu-Bi phase formed isothermally in liquid solders and considerably affected the Cu dissolution
kinetics. The results also show that Bi-Ag/Cu joints possessed a better shear strength than the Pb-Sn/Cu, which implies that
mechanical bonding by grain-boundary grooves was strong enough to withstand shear deformation. |
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Keywords: | High-temperature Pb-free solders Bi-Ag substrate dissolution shear strength |
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