| ENIG表面产生焊接界面断裂的关键失效模式 |
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| 引用本文： | 蔡积庆.ENIG表面产生焊接界面断裂的关键失效模式[J].印制电路信息,2003,1(11):43-48. |
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| 作者姓名： | 蔡积庆 |
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| 作者单位： | 南京无线电八厂 |
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| 摘 要： | 概述了固化不足的阻焊沾污了镀液,导致BLN焊接界面断裂,阐述了出现BLN现象的原因和怎样防止BLN现象。
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| 关 键 词： | 阻焊 化学镀镍浸金(ENIG) 黑线Ni(BLN) |
A Key Failure Mode Resulting in Interfacial Fracture of Soldered ENIG Surface |
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| Cai Jiqing.A Key Failure Mode Resulting in Interfacial Fracture of Soldered ENIG Surface[J].Printed Circuit Information,2003,1(11):43-48. |
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| Authors: | Cai Jiqing |
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| Abstract: | This paper summarizes that undercure soldermask contaminates the bath, leading to BLN joint fracture, also summarizes why BLN phenomenon occurs and how to prevent BLN phenomenon. |
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| Keywords: | soldermask electroless nickel immersion gold (ENIG) black-line nickel (BLN) |
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