Predictive modeling of transition undeformed chip thickness in ductile-regime micro-machining of single crystal brittle materials |
| |
| Authors: | Siva Venkatachalam Xiaoping Li Steven Y Liang |
| |
| Affiliation: | 1. Corning Incorporated, One Riverfront Plaza, Corning, NY 14831, USA;2. Department of Mechanical Engineering, National University of Singapore, Singapore 119260, Singapore;3. George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA 30332, USA;1. State Key Laboratory of Precision Measuring Technology & Instruments, Centre of MicroNano Manufacturing Technology, Tianjin University, Tianjin 300072, China;2. Institute of Mechanical Manufacturing Technology, China Academy of Engineering Physics, Sichuan 621900, China;3. School of Mechanical & Materials Engineering, MNMT-Dublin, University College Dublin, Dublin, Ireland;1. Department of Mechanical Engineering, Harbin Institute of Technology, Harbin 150001, China;2. Chengdu Fine Optic Engineering Research Center, Chengdu 610041, China;1. School of Mechanical Engineering, Nanjing University of Science and Technology, Nanjing, J.S, 210094, China;2. State Key Laboratory of Ultra-precision Machining Technology, Department of Industrial and Systems Engineering, The Hong Kong Polytechnic University, Kowloon, Hong Kong SAR, China;3. Department of Micro-Engineering, Kyoto University, Nishikyo-ku, Kyoto, 615-8540, Japan;4. College of Mechatronics and Control Engineering, Shenzhen University, Shenzhen, G.D, 518060, China;5. School of Mechanical and Aerospace Engineering, Jilin University, Changchun, J.L, 130022, China;1. School of Mechanical Engineering, Qingdao University of Technology, Qingdao 266520, China;2. Department of Biomedical Engineering, University of Southern California, Los Angeles, CA 90089-1111, USA;3. School of Mechanical and Manufacturing Engineering, The University of New South Wales, Sydney, NSW 2052, Australia |
| |
| Abstract: | This paper proposes a predictive model to determine the undeformed chip thickness in micro-machining of single crystal brittle materials, where the mode of chip formation transitions from the ductile to the brittle regime. The comprehensive model includes a force model considering the rounded tool edge radius effect and ploughing. Irwin's model for computing the stress intensity factor is adopted here as it gives a relation between the stress intensity and applied normal stress including effects of crack size and crack inclination. The occurrence of plastic deformation is built upon the condition that the shear stress in the chip formation region must be greater than the critical shear stress for chip formation and the stress intensity factor must be less than the fracture toughness of the material. The point of transition takes place when the fracture toughness is equal to the stress intensity factor. The above conditions form the theoretical basis for the proposed model in determining the transition undeformed chip thickness. End-turning experiments have been conducted using a single crystal diamond cutting tool on (1 1 1) single crystal silicon, and the results compared to the model predictions for validation. The proposed model would support the determination of the cutting conditions for the micro-machining of a brittle material in ductile manner without resorting to trial and error. |
| |
| Keywords: | |
| 本文献已被 ScienceDirect 等数据库收录！ |
|
