| Cu/Ti电子束叠加焊接对金属间化合物层的影响(英文) |
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| 引用本文： | 陈国庆,张秉刚,刘伟,冯吉才.Cu/Ti电子束叠加焊接对金属间化合物层的影响(英文)[J].中国有色金属学会会刊,2012,22(10):2416-2420. |
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| 作者姓名： | 陈国庆 张秉刚 刘伟 冯吉才 |
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| 作者单位： | 哈尔滨工业大学先进焊接与连接国家重点实验室 |
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| 基金项目： | Project (2010CB731704) supported by the National Basic Research Program of China |
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| 摘 要： | 对QCr0.8/TC4进行电子束焊接,研究焊缝中金属间化合物层(即IMC-layer)对接头力学性能的不利影响,提出利用电子束二次叠加焊接方式来改善接头性能的思路。结果表明,对中焊时在铜侧熔合线处形成的金属间化合物层,偏铜侧焊接时在钛侧熔合线处形成的金属间化合物层,是接头中的薄弱环节。利用电子束叠加焊接方式,须合理设计焊接顺序。先进行对中焊,再利用偏铜侧焊接,可将第一道焊缝形成的金属间化合物层破碎重熔,形成组织较好的化合物层,改善接头的力学性能。接头的抗拉强度为276.0MPa,达到了母材强度的76.7%。
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| 关 键 词： | Cu合金 Ti合金 电子束叠加焊接 金属间化合物层 |
| 收稿时间： | 9 July 2012 |
Influence of electron-beam superposition welding on intermetallic layer of Cu/Ti joint |
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| CHEN Guo-qing, ZHANG Bing-gang, LIU Wei, FENG Ji-cai.Influence of electron-beam superposition welding on intermetallic layer of Cu/Ti joint[J].Transactions of Nonferrous Metals Society of China,2012,22(10):2416-2420. |
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| Authors: | CHEN Guo-qing ZHANG Bing-gang LIU Wei FENG Ji-cai |
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| Affiliation: | State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China |
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| Abstract: | QCr0.8 was electron-beam welded to TC4 and the effect of the intermetallic layer (IMC-layer) on the mechanical properties of the joint was investigated. The IMC-layers are joint weaknesses at the Cu fusion line in centered welding and at the Ti fusion line when the beam is deviated towards Cu. A new method referred to as electron-beam superposition welding was presented, and the optimal welding sequence was considered. The IMC-layer produced by centered welding was fragmented and remelted during Cu-side non-centered welding, giving a finely structured compound layer and improved mechanical properties of the joint. The tensile strength of joint is 276.0 MPa, 76.7% that of the base metal. |
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| Keywords: | Cu alloy Ti alloy electron beam superposition welding IMC-layer |
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