云母带粘合剂导热系数的研究

多胶云母带广泛应用于大型高压电机的主绝缘材料,其导热性直接影响到空冷电机的温升及绝缘的可靠性。采用保护热流计法导热仪、浸渍法密度计研究了目前应用比较成熟的多胶云母带粘合剂的热传导性能及其与密度的关系。结果表明:酚类固化体系的导热系数明显高于TOA体系和桐马体系;酚类固化体系中引入TOA增韧后降低了固化物的导热系数;导热系数与密度存在一定的关系,密度较大的固化物其导热系数一般也较大。

Study on Thermal Conductivity of Mica Tape Adhesive

Resin-rich mica tapes have been widely used in high voltage large generator as main insulation.The thermal conductivity of which directly influences the temperature rise and the reliability of main insulation of air-cooled generator.Thermal conductivity of different kinds of resin-rich mica tape adhesives which were widely used at the present time was studied by guarded heat flow meter technique,and the relationship between thermal conductivity and density by immersion method of the adhesives was also studied in this paper.The results show that the thermal conductivity of the epoxy resin adhesive cured by phenolic hardeners is greater than cured by TOA or Tong-Ma.Introducing TOA as tough agent will reduce the thermal conductivity of the curing system.There has been a certain relationship between the density and the thermal conductivity of cured epoxy resin,the greater of the density,the higher the thermal conductivity.