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铜离子浓度对阴极铜表面质量的影响
引用本文:曹康学,郑继祖,朱福良.铜离子浓度对阴极铜表面质量的影响[J].甘肃冶金,2011,33(3):24-26.
作者姓名:曹康学  郑继祖  朱福良
作者单位:1. 金川集团有限公司精炼厂,甘肃金昌,737100
2. 兰州理工大学材料科学工程学院,甘肃兰州,730050
摘    要:本文模拟铜电解工艺条件,添加不同分子量范围的明胶与硫脲、干酪素组成添加剂,考察明胶分子量对阴极铜表面质量的影响.通过目测和金相显微观察对其影响效果进行评价.提出了阴极铜表面微结构模型.结果表明两种不同分子量的明胶组合后的效果明显好于一种明胶,两种明胶的分子量差别越大,也就是明胶的分子量分布范围越大,得到的电铜表面质量越...

关 键 词:铜电解  表面质量  明胶

The Effects of Copper Ion Concentration on the Surface Quality of Copper Electrodeposition
CAO Kang-xue,ZHENG Ji-zu,ZHU Fu-liang.The Effects of Copper Ion Concentration on the Surface Quality of Copper Electrodeposition[J].Gansu Metallurgy,2011,33(3):24-26.
Authors:CAO Kang-xue  ZHENG Ji-zu  ZHU Fu-liang
Affiliation:1.Jinchuan Group Limited Refinery,Jinchang 737100,China;2.Faculty of Materails Science and Engineering,Lanzhou University of Science and Technology,Lanzhou 730050,China)
Abstract:Refined copper was obtained by electrodeposition process with thiourea,gelatine and casein as additives.The effects of molecular weight of gelatine on the surface quality of copper electrodeposition have been investigated.The cathodes were characterized by visual inspection and metallographic methods.A mode of the micro-structure of cathode was presented.The results show that the effects of two kinds of gelatine are superior than that of one kind.A large difference of the molecular weights of gelatine are propitious to the surface quality of copper cathode.
Keywords:copper electrodeposition  surface quality  gelatine
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