累积叠轧焊多层铜基复合材料的强度预测

评价用累积叠轧焊(ARB)制备纳米结构Cu/Al/Ag多层复合材料的可行性,分析该复合材料的拉伸性能和电导率.利用强化机制和从X射线衍射获取的结构参数建立理论模型预测复合材料的抗拉强度.结果表明,随着ARB的进行,实验和计算得到的抗拉强度均有所提高,在第5个ARB循环时达到最大值,分别为450 MPa和510 MPa....

Strength prediction of multi-layered copper-based composites fabricated by accumulative roll bonding

This work aims to evaluate the feasibility of the fabrication of nanostructured Cu/Al/Ag multi-layered composites by accumulative roll bonding (ARB), and to analyze the tensile properties and electrical conductivity of the produced composites. A theoretical model using strengthening mechanisms and some structural parameters extracted from X-ray diffraction is also developed to predict the tensile strength of the composites. It was found that by progression of ARB, the experimental and calculated tensile strengths are enhanced, reach a maximum of about 450 and 510 MPa at the fifth cycle of ARB, respectively and then are reduced. The electrical conductivity decreased slightly by increasing the number of ARB cycles at initial ARB cycles, but the decrease was intensified at the final ARB cycles. In conclusion, the merit of ARB to fabricate this type of multi-layered nanocomposites and the accuracy of the developed model to predict tensile strength were realized.