High strain rate compression behavior for Sn-37Pb eutectic alloy, lead-free Sn-1Ag-0.5Cu and Sn-3Ag-0.5Cu alloys |
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| Authors: | S.T. Jenq Hsuan-Hu Chang Tsung-Yueh Tsai |
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| Affiliation: | a Institute of Aeronautics and Astronautics, National Cheng Kung University, Tainan 70101, Taiwan, ROC
b Central Labs., Advanced Semiconductor Engineering, Inc., 26 Chin 3rd Rd., Nantze Export Processing Zone, Nantze, Kaohsiung 811, Taiwan, ROC |
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| Abstract: | This paper emphasized on studying the high strain-rate compression behavior of the unleaded Sn-3Ag-0.5Cu (SAC305), Sn-1Ag-0.5Cu (SAC105) solders and the traditional Sn-37Pb eutectic solder. The split Hopkinson pressure bar (SHPB) apparatus was used to conduct high strain rate tests in order to characterize the associated high rate mechanical response of these alloys. Specimens were tested at strain rates ranging from 380 to 3030 s−1 to obtain the dynamic stress-strain relationship for the Sn-37Pb, SAC305 and SAC105 alloys. The tested soft and ductile samples experienced a large amount of elastoplastic deformation due to impact test. In the high strain rate range studied, limited strain rate hardening effect was observed for SAC305, SAC105 and Sn-37Pb alloys studied. The strain rate sensitivity parameter (m) related to the power law creep equation was also calculated for the present solder materials at specific strain values. In addition, the saturation stresses for the leaded and lead-free solders at the strain rate range studied are also reported. |
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