| CBGA组件热变形的3-D SOLID模型有限元分析 |
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| 引用本文： | 耿照新,杨玉萍,王卫宁. CBGA组件热变形的3-D SOLID模型有限元分析[J]. 电子器件, 2003, 26(2): 143-147,132 |
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| 作者姓名： | 耿照新 杨玉萍 王卫宁 |
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| 作者单位： | 1. 首都师范大学物理系,北京,100037
2. 中国科学院物理所,北京,100080 |
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| 摘 要： | 利用有限元中的3-DSOLID模型分析CBGA组件的热变形、应变和应力的分布，表明有限元法是研究微电子封装中BGA焊点、CBGA组件的可靠性的方法。
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| 关 键 词： | CBGA 热变形 焊点可靠性 有限元 |
| 文章编号： | 1005-9490(2003)02-0143-05 |
3-D SOLID Model of Finite Element Simulation Analysis in Thermal Deformation of CBGA Assembly |
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| GENG Zhaoxin YANG Yuping WANG Weining. 3-D SOLID Model of Finite Element Simulation Analysis in Thermal Deformation of CBGA Assembly[J]. Journal of Electron Devices, 2003, 26(2): 143-147,132 |
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| Authors: | GENG Zhaoxin YANG Yuping WANG Weining |
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| Affiliation: | GENG Zhaoxin YANG Yuping WANG WeiningDepartment of Physics,Capital Normal University,Beijing 100037,P.R.China, Institute of physics,CAS,Beijing 100080,P.R.China |
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| Abstract: | 3-D SOLID model of finite element simulation analysis was employed in CBGA thermal deformations, strain and stress. The results show finite element simulation analysis is a reliability method in study the BGA solder joint and the CBGA Assembly of microelectronic package. |
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| Keywords: | CBGA thennal deformation reliability of solder finite element simulation |
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