| Cu颗粒增强复合钎料钎焊接头的蠕变断裂及强化机理 |
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| 引用本文： | 闫焉服,冯丽芳,纪莲清,闫红星,于华.Cu颗粒增强复合钎料钎焊接头的蠕变断裂及强化机理[J].机械工程学报,2007,43(10):201-205. |
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| 作者姓名： | 闫焉服 冯丽芳 纪莲清 闫红星 于华 |
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| 作者单位： | 河南科技大学材料科学与工程学院,洛阳,471003;郑州轻工业学院机电工程学院,郑州,450002 |
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| 基金项目： | 河南省科技攻关项目
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河南科技大学校科研和教改项目 |
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| 摘 要： | 测定不同应力和温度下Cu颗粒增强复合钎料及基体钎料钎焊接头蠕变寿命，分析Cu颗粒增强复合钎料及其基体钎料63Sn37Pb钎焊接头蠕变断裂机理。结果表明：Cu颗粒增强复合钎料钎焊接头蠕变寿命优于基体钎料。Cu颗粒表面金属间化合物形成及Cu颗粒对富Pb层阻碍作用是复合钎料钎焊接头蠕变性能改善的主要因素。钎焊接头铜基板上一薄层富Pb相的形成是蠕变裂纹产生的根源。
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| 关 键 词： | Cu颗粒 复合钎料 蠕变寿命 蠕变断裂 蠕变强化机理 |
| 修稿时间： | 2006年10月24 |
CREEP RUPTURE AND ENHANCEMENT MECHANISM OF CU PARTICLE ENHANCEMENT COMPOSITE SOLDER JOINTS |
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| YAN Yanfu,FENG Lifang,JI Lianqing,YAN Hongxing,YU Hua.CREEP RUPTURE AND ENHANCEMENT MECHANISM OF CU PARTICLE ENHANCEMENT COMPOSITE SOLDER JOINTS[J].Chinese Journal of Mechanical Engineering,2007,43(10):201-205. |
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| Authors: | YAN Yanfu FENG Lifang JI Lianqing YAN Hongxing YU Hua |
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| Affiliation: | School of Materials Science and Engineering, Henan University of Science and Technology |
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| Abstract: | Creep rupture lifetimes of Cu particle enhancement SnPb based composite solder joints and the matrix solder joints are tested under different temperatures and stresses and the creep rupture mechanism is analyzed.Results show that the creep resistance of the composite solder joints is superior to that of the matrix solder joints.It is the main reason that the Cu_6Sn_5 intermetallic compound layer formed between the matrix and the counteract of Cu particles to creep behavior make for the high creep resistance of the composite solder.A thin Pb-rich phase which lies on the cooper substrate of solder joints cause directly the creep rupture of the solder joints. |
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| Keywords: | Cu particles Composite solder Creep rupture life Creep rapture Creep enhancement mechanism |
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