Ultrahigh Conductive Copper/Large Flake Size Graphene Heterostructure Thin‐Film with Remarkable Electromagnetic Interference Shielding Effectiveness |
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Authors: | Zhe Wang Boyang Mao Qianlong Wang Jun Yu Jixiang Dai Rongguo Song Zonghua Pu Daping He Zhi Wu Shichun Mu |
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Affiliation: | 1. State Key Laboratory of Advanced Technology for Materials Synthesis and Processing, Wuhan University of Technology, Wuhan, China;2. National Graphene Institute, University of Manchester, Manchester, UK;3. Shenzhen Institute of Advanced Graphene Application and Technology (SIAGAT), Shenzhen, China;4. National Engineering Laboratory for Fiber Optic Sensing Technology, Wuhan University of Technology, Wuhan, China;5. Hubei Engineering Research Center of RF‐Microwave Technology and Application, School of Science, Wuhan University of Technology, Wuhan, China |
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Abstract: | To guarantee the normal operation of next generation portable electronics and wearable devices, together with avoiding electromagnetic wave pollution, it is urgent to find a material possessing flexibility, ultrahigh conductive, and superb electromagnetic interference shielding effectiveness (EMI SE) simultaneously. In this work, inspired by a building bricks toy with the interlock system, we design and fabricate a copper/large flake size graphene (Cu/LG) composite thin film (≈8.8 μm) in the light of high temperature annealing of a large flake size graphene oxide film followed by magnetron sputtering of copper. The obtained Cu/LG thin‐film shows ultrahigh thermal conductivity of over 1932.73 (±63.07) W m?1 K?1 and excellent electrical conductivity of 5.88 (±0.29) × 106 S m?1. Significantly, it also exhibits a remarkably high EMI SE of over 52 dB at the frequency of 1–18 GHz. The largest EMI SE value of 63.29 dB, accorded at 1 GHz, is enough to obstruct and absorb 99.99995% of incident radiation. To the best of knowledge, this is the highest EMI SE performance reported so far in such thin thickness of graphene‐based materials. These outstanding properties make Cu/LG film a promising alternative building block for power electronics, microprocessors, and flexible electronics. |
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Keywords: | electrical conductivity electromagnetic interference shielding films large flake size graphene thermal conductivity |
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