| 应力对SnPb基复合钎料钎焊接头蠕变性能的影响 |
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| 引用本文： | 刘建萍,闫焉服,郭福,史耀武,XIA Zhi-dong.应力对SnPb基复合钎料钎焊接头蠕变性能的影响[J].焊接学报,2004,25(5):70-73. |
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| 作者姓名： | 刘建萍 闫焉服 郭福 史耀武 XIA Zhi-dong |
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| 作者单位： | 北京工业大学,材料科学与工程学院,北京,100022 |
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| 基金项目： | 北京市科学技术委员会资助项目 ( 95 5 0 3 10 3 0 0 ) |
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| 摘 要： | 采用搭接面积为1mm^2的单搭接钎焊接头，研究了恒定温度下，应力对纳米颗粒增强的SnPb基复合钎料钎焊接头的蠕变寿命的影响。结果表明，纳米颗粒增强的SnPb基复合钎料的蠕变抗力优于传统SnPb钎料。同时钎焊接头的蠕变寿命随应力增加而降低，且应力对复合钎料钎焊接头蠕变寿命的影响较传统63Sn37Pb钎料明显。
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| 关 键 词： | 蠕变寿命 复合钎料 颗粒增强 63Sn37Pb 应力 |
| 文章编号： | 0253-360X(2004)05-70-04 |
| 收稿时间： | 2003/12/10 0:00:00 |
Influence of stress on creep behavior of SnPb based composite soldered joint |
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| LIU Jian-ping,YAN Yan-fu,GUO Fu,SHI Yao-wu and XIA Zhi-dong.Influence of stress on creep behavior of SnPb based composite soldered joint[J].Transactions of The China Welding Institution,2004,25(5):70-73. |
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| Authors: | LIU Jian-ping YAN Yan-fu GUO Fu SHI Yao-wu and XIA Zhi-dong |
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| Affiliation: | Key Laboratory of Advanced Functional Materials of the State Education Ministry, School of Material Science and Engineering, Beijing University of Technology, Beijing 100022, China,Key Laboratory of Advanced Functional Materials of the State Education Ministry, School of Material Science and Engineering, Beijing University of Technology, Beijing 100022, China,Key Laboratory of Advanced Functional Materials of the State Education Ministry, School of Material Science and Engineering, Beijing University of Technology, Beijing 100022, China,Key Laboratory of Advanced Functional Materials of the State Education Ministry, School of Material Science and Engineering, Beijing University of Technology, Beijing 100022, China and Key Laboratory of Advanced Functional Materials of the State Education Ministry, School of Material Science and Engineering, Beijing University of Technology, Beijing 100022, China |
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| Abstract: | Single shear lap creep specimens with a 1 mm~2 cross sectional area were developed using Ag particles enhanced 63Sn37Pb based composite solder to invesitigate the influence of stress on creep behavior of the composite solder. The results indicated that the creep resistance of soldered joints of Ag particles enhanced 63Sn37Pb based composite solder is superior to that of soldered joints produced using the conventional 63Sn37Pb solder. Creep rupture lifetimes of the soldered joints of the composite solder decrease with increasing stress and more sensitive to the stress than those of the conventional 63Sn37Pb eutectic solder. |
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| Keywords: | creep rupture life composite solder particle-enhance 63Sn-37Pb stress |
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