Bond integrity evaluation using transmission scanning acoustic microscopy |
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| Authors: | Sinclair D.A. Ash E.A. |
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| Affiliation: | University College London, Department of Electronic & Electrical Engineering, London, UK; |
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| Abstract: | Low frequency transmission scanning acoustic microscopy is capable of revealing voids and delaminations at substantial depths inside a solid material. The technique is demonstrated with reference to the bond between a carbon diamond compound sintered to a steel base. A resolution comparable to the wavelength inside the solid material is achieved. |
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