| 银粉浆料的研究进展及发展趋势 |
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| 引用本文： | 张玉红,严彪.银粉浆料的研究进展及发展趋势[J].金属功能材料,2012,19(5):36-40. |
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| 作者姓名： | 张玉红 严彪 |
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| 作者单位： | 同济大学材料科学与工程学院,上海,201804 |
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| 摘 要： | 本文介绍了广泛用于电子行业的电子浆料的国内外研究现状,并着重讨论了银浆料的组成相:银粉的制备方法及其对浆料的影响；玻璃相的组成对银浆性能的影响以及添加物对银浆性能的影响.并介绍了电子浆料的应用前景及发展趋势.
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| 关 键 词： | 电子浆料 银浆 玻璃相 应用 |
Recent Progress and Development Trends of Silver Slurry |
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| ZHANG Yu-hong
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YAN Biao.Recent Progress and Development Trends of Silver Slurry[J].Metallic Functional Materials,2012,19(5):36-40. |
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| Authors: | ZHANG Yu-hong YAN Biao |
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| Affiliation: | (Institution of Material Science and Project, Tongji University, Shanghai 200092, China) |
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| Abstract: | The present progress and development trends of silver slurry for electronics were recommended. The in fluences of preparation of silver powder, components of glass phase and additives on the electronic paste are dis cussed emphatically. Meanwhile, the application and the development tendency of the electronic paste are also stud ied. |
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| Keywords: | electronic paste silver paste glass phase application |
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