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Thermal conductivity of CVD diamond films
Authors:H B Chae  K H Park  D J Seong  J C Kim  Y J Baik
Affiliation:(1) Physics Department, Soonchunhyang University, Onyang, P.O. Box 97, 337-745 Chungnam, Republic of Korea;(2) Physics Department, Choongbook National University, 360763 Chungju, Republic of Korea;(3) Humidity and Thermophysics Group, Korea Research Institute of Standards and Science, 305-606 Daejon, Republic of Korea;(4) Division of Ceramics, Korea Institute of Science and Technology, Cheongryang, P.O. Box 131, 130-650 Seoul, Republic of Korea
Abstract:Diamond films 60 and 170 µm in thickness were grown by PACVD (plasma-assisted chemical vapor deposition) under similar conditions. The thermal diffusivity of these freestanding films was measured between 100 and 300 K using AC calorimetry. Radiation heat loss from the surface was estimated by analyzing both the amplitude and the phase shift of a lock-in amplifier signal. Thermal conductivity was calculated using the specific heat data of natural diamond. At room temperature, the thermal conductivity of the 60 and 170 ugrm films is 9 and 16 W-cm–1. K–1 respectively, which is 40–70% that of natural diamond, The temperature dependence of thermal conductivity of the CVD diamond films is similar to that of natural diamond, Phonon scattering processes are considered using the Debye model, The microsize of the grain boundary has a significant effect on the mean free path of phonons at low temperatures. The grain in CVD diamond film is grown as a columnar structure, Thus, the thicker film has the larger mean grain size and the higher thermal conductivity. Scanning electron microscopy (SEM) and Raman spectroscopy were used to study the microstructure of the CVD diamond films. In this experiment, we evaluated the quality of CVD diamond film of the whole sample by measuring the thermal conductivity.Paper presented at the Twelfth Symposium on Thermophysical Properties, June 19–24, 1994, Boulder, Colorado, U.S.A.
Keywords:AC calorimetry  CVD diamond film  Debye phonon model  grain boundary  thermal conductivity  thermal diffusivity  U-process
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