首页 | 本学科首页   官方微博 | 高级检索  
     

高频馈源喇叭密封罩工艺性能研究
引用本文:韦生文,姜海涛. 高频馈源喇叭密封罩工艺性能研究[J]. 电子工艺技术, 2010, 31(4): 241-244
作者姓名:韦生文  姜海涛
作者单位:中国电子科技集团38研究所,安徽,合肥,230031;中国电子科技集团38研究所,安徽,合肥,230031
摘    要:主要介绍了某馈源喇叭特殊的气密性要求及在高频环境下对密封罩的电性能要求,选择使用两面覆铜的高频微波基板作为馈源喇叭的密封罩材料,采用焊接的密封连接方式.并分别从密封罩的结构构成、材料成分、电性能特点、可加工性及焊接强度等方面阐述了此种高频微波基板的经济性和可靠性,完全满足馈源喇叭气密性及透波性性能指标要求.

关 键 词:高频  密封  介电性能  覆铜板  焊接

Technology of high frequency feeder horn sealing cover
WEI Sheng-wen,JIANG Hai-tao. Technology of high frequency feeder horn sealing cover[J]. Electronics Process Technology, 2010, 31(4): 241-244
Authors:WEI Sheng-wen  JIANG Hai-tao
Affiliation:WEI Sheng-wen JIANG Hai-tao(The 38th Research Institute of CETC,Hefei 230031,China)
Abstract:Mainly introduce the requirements of special airproof and electrical function of the cover under high frequency environment of some feeder horn.High frequency microwave base-plate with double side copper was chose as the cover material of feeder horn,and welding was used as a mode of seal and connection.The economical efficiency and reliability of the high frequency microwave base-plate were respectively expatiated from the structure,material,electrical function,machinability and welding strength of sealed ...
Keywords:High frequency  Seal  Dielectric performance  Copper clad laminate  Welding  
本文献已被 CNKI 维普 万方数据 等数据库收录!
设为首页 | 免责声明 | 关于勤云 | 加入收藏

Copyright©北京勤云科技发展有限公司  京ICP备09084417号