In situ investigation of SnAgCu solder alloy microstructure |
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Authors: | Alena Pietriková Jozef Bednar?íkJuraj ?urišin |
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Affiliation: | a Department of Technologies in Electronics, Faculty of Electrical Engineering and Informatics, Technical University of Kǒsice, Kǒsice, Slovak Republic b Deutsches Elektronen-Synchrotron (DESY), HASYLAB, Notkestrasse 85, D-22603 Hamburg, Germany |
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Abstract: | In situ X-ray diffraction experiments, using synchrotron radiation, were employed to analyze microstructure evolution of the 96.5Sn3Ag0.5Cu (wt.%)—SAC305 lead-free solder alloy during heating (30-240 °C), isothermal dwell (240 °C) and cooling (240-30 °C). The special emphasis was placed on the study of the melting and solidification processes, explaining formation, distribution and the order of crystallization of the crystal phases (β-Sn, intermetallic compounds) in the solder alloy. Furthermore, thermal expansion behaviour of the main constituent phase β-Sn was analyzed prior to melting and after the consequent solidification. |
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Keywords: | SnAgCu solder alloy Microstructure In situ X-ray diffraction Soldification process β-Sn thermal expansion coefficient |
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