| 用FIFO实现超声测厚系统A/D与ARM接口设计 |
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| 引用本文： | 林国庆,高晓蓉,王黎,王泽勇.用FIFO实现超声测厚系统A/D与ARM接口设计[J].现代电子技术,2010,33(8):35-37. |
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| 作者姓名： | 林国庆 高晓蓉 王黎 王泽勇 |
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| 作者单位： | 西南交通大学,物理科学与技术学院,四川,成都,610031 |
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| 摘 要： | 在基于ARM的超声波测厚系统中,ARM处理器的数据接收能力往往与A/D芯片的工作速率不匹配,为避免有效数据丢失,提高系统工作效率,用FIFO作为高速A/D与ARM处理器之间的中转接口会得到很好的效果。这里以FIFO存储器CY7C4261作为中转器件实现了A/D芯片AD9283与ARM处理器S3C2410的接口设计,并叙述了数据从A/D芯片到ARM的整个数据采集过程。该接口电路用FIFO实现了超声测厚系统中A/D与ARM之间的无缝连接,提高了系统测厚精度。它的电路简单,调试方便,具有较高的应用价值。
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| 关 键 词： | FIFO A/D ARM 接口电路 |
Design of A/D and ARM Interface for Ultrasonic Thickness Measurement System Based on FIFO |
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| LIN Guo-qing,GAO Xiao-rong,WANG Li,WANG Ze-yong.Design of A/D and ARM Interface for Ultrasonic Thickness Measurement System Based on FIFO[J].Modern Electronic Technique,2010,33(8):35-37. |
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| Authors: | LIN Guo-qing GAO Xiao-rong WANG Li WANG Ze-yong |
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| Affiliation: | LIN Guo-qing,GAO Xiao-rong,WANG Li,WANG Ze-yong (School of Physical Science , Technology,Southwest Jiaotong University,Chengdu 610031,China) |
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| Abstract: | In the ultrasonic thickness measurement system based on ARM,usually,the data reception capability of ARM cannot match the operation speed of A/D chip.In order to avoid loss of the valid data and improve the efficiency of the system,taking a FIFO chip as the transfer interface between the high-speed A/D chip and ARM processor can get good result.The design of the transfer interface between the A/D chip AD9283 and the ARM chip S3C2410 was realized with the FIFO chip CY7C4261 as a transfer device.The whole pro... |
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| Keywords: | FIFO A/D ARM |
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