| 晶片干燥技术综述 |
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| 引用本文： | 张伟才,宋晶. 晶片干燥技术综述[J]. 电子工业专用设备, 2012, 41(9): 8-10 |
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| 作者姓名： | 张伟才 宋晶 |
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| 作者单位： | 中国电子科技集团公司第四十六研究所,天津,300220 |
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| 摘 要： | 在各类晶片中,尤以衬底抛光片的干燥最为困难,容易出现颗粒和水痕等缺陷。以设备为依托的干燥技术发展迅速,离心甩干技术,IPA Vapor干燥,Marangoni干燥和HF/O3干燥是其中较为成功的。
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| 关 键 词： | 干燥 离心甩干 IPA干燥 干燥缺陷 |
The Review of Wafer Drying Technology |
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| ZHANG Weicai,SONG Jing. The Review of Wafer Drying Technology[J]. Equipment for Electronic Products Marufacturing, 2012, 41(9): 8-10 |
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| Authors: | ZHANG Weicai SONG Jing |
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| Affiliation: | (The 46th Research Institute of CETC,Tianjin 300220,China) |
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| Abstract: | Along with the increasing demand of semiconductor device technology on the chip quality,the focus of cleaning process had changed to be drying technology.The drying of bare plolished wafer was the most difficult,with the higher proportion of particle and watermark.Drying technology is dependent on the device.The Spin-Rinse-Dryer,IPA Vapor Dry,Marangoni dry and 和 HF/O3 dry were successful technology. |
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| Keywords: | Dry Spin dry IPA dry Dry defect |
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