垂直线不良分析与改善

针对栅极绝缘层和栅极引线接触处形成过孔倒角造成的一种垂直线不良进行分析和改善。研究气相沉积、干法刻蚀和磁控溅射对过孔倒角的影响,通过扫描电子显微镜对过孔形貌进行表征,并用成盒检测设备检测不良发生情况。实验结果表明:通过过孔刻蚀功率、气压、气体流量的变更可以消除倒角现象,垂直线不良由1.4%降为0.7%。

Analysis and improvement of vertical line mura

The vertical line mura which was caused by the via hole undercut between gate insulating layer and gate line has been researched. The effect of plasma enhanced chemical vapor deposition (PECVD), dry etch, sputter on via hole undercut was studied, and via hole morphology was characterized by scanning electron microscopy (SEM), the ratio of vertical line mura was tested by cell test equipment. The via hole undercut can be removed by changing via etch power, pressure, gas flow, and the vertical line was reduced from 1.4% to 0.7%.