| 非金属材料化学镀的应用新进展 |
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| 引用本文： | 时刻,黄英,李鹏,廖梓珺.非金属材料化学镀的应用新进展[J].玻璃钢/复合材料,2005(2):45-48,40. |
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| 作者姓名： | 时刻 黄英 李鹏 廖梓珺 |
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| 作者单位： | 1. 西北工业大学应用化学系,西安,710072
2. 解放军后勤工程学院油化系,重庆,400016 |
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| 摘 要： | 化学镀作为表面强化的途径,已受到广泛的重视.本文简要介绍了非金属材料化学镀工艺中基体表面活化的几种方法,包括光化学法、自催化活化法、介电层放电法和气相沉积法,综述了化学镀技术在多种非金属材料上的最新进展及应用前景.
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| 关 键 词： | 非金属化学镀 活化工艺 复合镀 应用 非金属材料 化学镀技术 应用新进展 MATERIALS ELECTROLESS PLATING PROGRESS 前景 气相沉积法 放电法 介电层 自催化活化法 光化学法 方法 表面活化 基体 化学镀工艺 表面强化 |
| 文章编号： | 1003-0999(2005)02-0045-05 |
CURRENT PROGRESS IN ELECTROLESS PLATING OF NON-METALLIC MATERIALS |
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| SHI Ke,HUANG Ying,LI Peng,LIAO Zi-Jun.CURRENT PROGRESS IN ELECTROLESS PLATING OF NON-METALLIC MATERIALS[J].Fiber Reinforced Plastics/Composites,2005(2):45-48,40. |
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| Authors: | SHI Ke HUANG Ying LI Peng LIAO Zi-Jun |
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| Abstract: | The electroless plating technology has been progressed constantly and paid more attention to as a way of surface hardening.In this paper several substrate surface activation methods in electroless plating of non-metallic materials are briefly introduced,including photochemical activation,autocatalytic activation,DBD activation and vapor deposition activation.The development and the direction of the electroless plating technology application in several non-metallic materials are described. |
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| Keywords: | electroless plating non-metallic material activating process application |
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