Analysis on the cooling performance of the thermoelectric micro-cooler |
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| Affiliation: | 1. Microsystem and Terahertz Research Center, China Academy of Engineering Physics, Chengdu 610200, Sichuan, PR China;2. Institute of Electronic Engineering, China Academy of Engineering Physics, Mianyang 621999, Sichuan, PR China;3. School of Mechanical Engineering, Virginia Polytechnic Institute and State University, Blacksburg 24060, USA;4. School of Civil Engineering and Architecture, Wuhan University of Technology, No. 122, Luoshi Road, Wuhan 430070, PR China;1. Key Laboratory of Hydraulic Machinery Transients (Wuhan University), Ministry of Education, Wuhan, Hubei Province, China;2. Hubei Key Laboratory of Waterjet Theory and New Technology (Wuhan University), Wuhan, Hubei Province, China;3. School of Power and Mechanical Engineering, Wuhan University, Wuhan, Hubei Province, China;4. College of Pipeline and Civil Engineering, China University of Petroleum, Qingdao, Shandong Province, China |
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| Abstract: | Numerical analysis has been carried out to figure out the performance of the thermoelectric micro-cooler with the three-dimensional model. A small-size and column-type thermoelectric cooler is considered and Bi2Te3 and Sb2Te3 are selected as the n- and p-type thermoelectric materials, respectively. The thickness of a thermoelectric element considered is 5–20 μm. The effect of parameters such as the temperature difference, the current, the thickness of a thermoelectric element, and the number of thermoelectric pairs on the performance of the cooler has been investigated. The predicted results show that the performance can be improved for the thick element with the large number of thermoelectric pairs or the small cross-sectional area of the element. |
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