| 发光二极管引线键合可靠性探讨 |
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| 引用本文： | 蔡伟智. 发光二极管引线键合可靠性探讨[J]. 电子质量, 2007, 0(4): 34-36 |
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| 作者姓名： | 蔡伟智 |
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| 作者单位： | 厦门三安电子有限公司,厦门,361009 |
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| 摘 要： | 本文简要地描述发光二极管金丝引线键合过程,讨论分析了影响其键合可靠性的主要因素,说明了键合质量的评价方法,提出了增强键合可靠性的措施,以达到提高发光二极管寿命的目的.
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| 关 键 词： | 发光二极管 引线键合 工艺参数 可靠性 芯片 |
| 文章编号： | 1003-0107（2007）04-0034-03 |
Wire Bonding Reliability for Light Emitting Diode |
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| Cai Wei-zhi. Wire Bonding Reliability for Light Emitting Diode[J]. Electronics Quality, 2007, 0(4): 34-36 |
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| Authors: | Cai Wei-zhi |
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| Affiliation: | Xiamen Sanan Electronics Co., Ltd.,Xiamen 361009 |
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| Abstract: | This article is a brief account of gold wire bonding for LED,concerning its process,main factors influencing on reliability,characterization for quality.Further measurement techniques are also proposed to improve the bonding reliability in order to prolong the life of LED. |
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| Keywords: | Light Emitting Diode(LED) Wire Bonding(WB) Process Parameters Reliability Chip |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ |
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