废旧塑封芯片分层裂纹仿真

分析了废旧塑封芯片的分层机理,计算得到了芯片分层界面裂纹断裂能释放率并建立了界面裂纹扩展判断准则。通过仿真分析分别获得了芯片内部应力载荷、裂纹长度与裂纹扩展所需断裂能释放率之间的影响规律。结果表明，塑封芯片存在的内应力及其内部结构上的缺陷，均可导致分层裂纹的产生与扩展。最后基于理论与仿真计算的结果分析了旧芯片回收重用工艺，并提出减小芯片分层损伤的工艺方法。

Simulation of Interfacial Delamination Crack of Waste Plastic Chips

This paper briefly analyzed the delaminated mechanism of waste plastic chips,got the facture energy release rate of chip layered interface crack through calculation, and established the judging criteria of interface crack propagation. Through simulation analysis, the influence rules among the chip internal stress load, crack length and fracture energy release rate required for crack propagation were obtained respectively. The results show that, the internal stress and structure's defects of the waste plastic chips can lead to delamination crack's generation and expansion. Finally, based on the results of theoretical and simulation calculations, this paper analyzed the old chip recycling and reuse technology, and proposed technical method to reduce the scathing of chip delamination.