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| 贴片电容器失效分析 | |
| 引用本文： | 汪洋,何为,莫云绮,林均秀,徐玉珊.贴片电容器失效分析[J].电子元件与材料,2008,27(11). |
| 作者姓名： | 汪洋 何为 莫云绮 林均秀 徐玉珊 |
| 作者单位： | 1. 信息产业部,电子第五研究所可靠性研究分析中心,广东,广州,510610 2. 电子科技大学,应用化学系,四川,成都,610054 3. 珠海元盛电子科技有限公司,技术中心,广东,珠海,519060 |
| 摘 要： | 采用外观检查、金相切片、SEM和EDS分析等手段,通过对贴片电容器失效实例的分析,介绍了对贴片电容器失效的分析过程与方法,得出了内部电极间的陶瓷介质裂纹存在并联电阻特性,这是导致电容器产生漏电失效的主要原因,该裂纹属制造缺陷。失效分析对贴片电容器制造工艺有质量控制作用。 |
| 关 键 词： | 电子技术 贴片电容 失效分析 外观检查 金相切片分析 |
Failure analysis for the chip capacitor |
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| WANG Yang,HE Wei,MO Yun-qi,LIN Jun-xiu,XU Yu-san.Failure analysis for the chip capacitor[J].Electronic Components & Materials,2008,27(11). | |
| Authors: | WANG Yang HE Wei MO Yun-qi LIN Jun-xiu XU Yu-san |
| Affiliation: | WANG Yang1,HE Wei2,MO Yun-qi2,LIN Jun-xiu3,XU Yu-san3 ( 1. Reliability Research , Analysis Center,the Fifth Electronics Research Institute of the Ministry of Information Industry,Guangzhou 510610,China,2. Department of Applied Chemistry,University of Electronic Science , Technology of China,Chengdu 610054,3. Technology Center,Zhuhai Topsun Electric Technology Co.,Ltd,Zhuhai 519060,Guangdong Province,China ) |
| Abstract: | The analysis process and methods of failure chip capacitors were introduced by a failure analysis case for an actual chip capacitor with visual inspection, cross section analysis and SEM and EDS analysis . The analysis results show that the crack existed parallel resistance characteristic in ceramic dielectric materials between inner two electrodes is main reason for the capacitor current leakage failure. The crack belongs fabricating defect. Failure analysis possesses quality control action for chip capaci... |
| Keywords: | electron technology chip capacitor failure analysis visual inspection cross section analysis |
| 本文献已被 CNKI 万方数据 等数据库收录！ | |