| 基于ANSYS/LS-DYNA的微流控芯片模内动力学特性研究 |
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| 引用本文： | 蒋炳炎,陈闻,袁理,李代兵.基于ANSYS/LS-DYNA的微流控芯片模内动力学特性研究[J].郑州大学学报(工学版),2010,31(2). |
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| 作者姓名： | 蒋炳炎 陈闻 袁理 李代兵 |
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| 作者单位： | 中南大学,现代复杂装备设计与极端制造教育部重点实验室,湖南,长沙,410083 |
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| 摘 要： | 以有限元法的系统动力学理论为基础,采用显式ANSYS/LS—DYNA有限元分析软件对微流控芯片模内键合模具模内运动元件进行了模拟仿真计算,并对计算结果进行分析.以计算结果为依据,对模具的结构进行改进,优化其结构,改善受力状况.研究结果表明:模内元件最大应力值均在各元件材料屈服极限范围内;关键结点位移对模腔对准精度产生一定影响.研究结果为模内装配模具(IMA)结构设计开发提供了理论依据,对深入研究模芯制动与模具疲劳寿命间关系及提高模具寿命提供了理论.
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| 关 键 词： | 模内键合 模芯运动定位 有限元显式动力学分析 模具寿命 |
The Analysis of In-mold Dynamics about the Microfluidic Chips Based on Ansys/ls-Dyna |
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| JIANG Bing-yan
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CHEN Wen
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YUAN Li
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LI Dai-bing.The Analysis of In-mold Dynamics about the Microfluidic Chips Based on Ansys/ls-Dyna[J].Journal of Zhengzhou University: Eng Sci,2010,31(2). |
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| Authors: | JIANG Bing-yan CHEN Wen YUAN Li LI Dai-bing |
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| Affiliation: | JIANG Bing-yan,CHEN Wen,YUAN Li,LI Dai-bing (Key Laboratory of Modern Complex Equipment Design , Extreme Manufacturing Ministry of Education,Central South University,Changsha 410083,China) |
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| Abstract: | With the finite elements model based on system dynamical theory and with the help of ANSYS/LS-DYNA,the research simulates the in-mold dynamics for microfluidic chips.Based on the results of the simulation,the research shows that:the maximum Von mises stress is below the materials summit limits;the key points displacements have certain impact on the alignment precision of the mold cavities.The research provides the theory for the in-mold assemble(IMA) technology. |
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| Keywords: | in-mold assemble mold cavities alignment ANSYS/LS-DYNA mold life |
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