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Higher Order Assembly of Virus‐like Particles (VLPs) Mediated by Multi‐valent Protein Linkers
Authors:Masaki Uchida  Ben LaFrance  Chris C Broomell  Peter E Prevelige Jr  Trevor Douglas
Affiliation:1. Department of Chemistry, Indiana University, Bloomington, IN, USA;2. Department of Chemistry and Biochemistry, Montana State University, Bozeman, MT, USA;3. Wyatt Technology Coporation, Santa Barbara, CA, USA;4. Department of Microbiology, University of Alabama at Birmingham, Birmingham, AL, USA
Abstract:Two‐ and three‐dimensional assembly of nanoparticles has generated significant interest because these higher order structures could exhibit collective behaviors/properties beyond those of the individual nanoparticles. Highly specific interactions between molecules, which biology exploits to regulate molecular assemblies such as DNA hybridization, often provide inspiration for the construction of higher order materials using bottom‐up approaches. In this study, higher order assembly of virus‐like particles (VLPs) derived from the bacteriophage P22 is demonstrated by using a small adaptor protein, Dec, which binds to symmetry specific sites on the P22 capsid. Two types of connector proteins, which have different number of P22 binding sites and different geometries (ditopic linker with liner geometry and tetratopic linker with tetrahedral geometry) have been engineered through either a point mutation of Dec or genetic fusion with another protein, respectively. Bulk assembly and layer‐by‐layer deposition of P22 VLPs from solution was successfully achieved using both of the engineered multi‐topic linker molecules, while Dec with only a single binding site does not mediate P22 assembly. Beyond the two types of linkers developed in this study, a wide range of different connector geometries could be envisioned using a similar engineering approach. This is a powerful strategy to construct higher order assemblies of VLP based nanomaterials.
Keywords:virus‐like particles  assembly  bacteriophages  protein linkers  layer‐by‐layer deposition
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