Yield Strengths of Biaxially Textured Metallic Substrates (Ni and its Alloys) Determined Using a Simplified Test Method

A simple testing method is used to compare the yield strengths (YS) of biaxially textured metallic substrates (Ni and its alloys) presently under development for YBa₂Cu₃O_7−x coated conductors. This method is based on a retired ASTM D3379 tensile test standard method that was originally recommended for single filament materials. Several common textured substrates, such as Ni, Ni-3at.%W, and Ni-5at.%W, procured from different manufacturers, were tested using this method, and the data were compared with the values reported in the literature. A new alloy substrate (constantan (Cu55-Ni44-Mn1wt.%)) that is biaxially textured in-house was also tested using this method, and the YS data were compared with those of other substrates. For the substrates used in this study, the data obtained using this method indicated that Ni substrates have YS of ∼52 MPa, Ni-3at.%W substrates have YS of ∼106 MPa, Ni-5at.%W substrates have YS 163 MPa, and Cu55-Ni44-Mn1 wt.% substrates have YS of 74 MPa.