Thermal stress hysteresis and stress relaxation in an epoxy film |
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| Authors: | Jeremy Thurn Theresa Hermel-Davidock |
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| Affiliation: | (1) Advanced Mechanical Technology, Mechanical Research and Development, Seagate Technology, Bloomington, MN 55435, USA;(2) Materials Science and Modeling, Performance Plastics and Chemicals R&D, The Dow Chemical Company, Freeport, TX 77541, USA |
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| Abstract: | Thermal cycling of an epoxy coating on silicon through the glass transition temperature (T
g) revealed a large stress hysteresis on the first thermal cycle through T
g and a change in the stress–temperature slope at T
g resulting from the change in the epoxy elastic properties due to the glass transition. This stress hysteresis was not observed
on subsequent thermal cycles through T
g. However, after the coating was annealed (aged) below T
g (for hours or longer)—during which the stress relaxed exponentially with time—the stress hysteresis returned. The magnitude
of stress hysteresis, on cycling through T
g, was found to correlate to the magnitude of long-time relaxation that occurred during annealing at temperatures below T
g. |
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