Simulation of thermally induced package effects with regard to piezoresistive pressure sensors

Microsystems are on their way out of laboratories into production. One of these microsystems, a piezoresistive pressure sensor developed by Robert Bosch GmbH, is examined within this paper. Obviously, one can detect undesirable temperature effects resulting from the sensor package, which influence the electrical characteristics of the sensor. By means of finite-element modelling (FEM), a simulation of the temperature effects can be managed. It is also possible to search for alternative designs of the sensor package.