Lead-Free Bumping Using an Alternating Electromagnetic Field |
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| Authors: | Hongbo Xu Mingyu Li Hongtao Chen Yonggao Fu Ling Wang |
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| Affiliation: | (1) State Key Laboratory of Advanced Welding Production Technology, Harbin Institute of Technology Shenzhen Graduate School, Shenzhen, 518055, China;(2) China National Electric Apparatus Research Institute, Guangzhou, 510300, China;(3) Department of Materials Science and Engineering, Jiamusi University, Jiamusi, 154007, China |
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| Abstract: | A novel lead-free bumping technique using an alternating electromagnetic field (AEF) was investigated. Lead-free solder bumps
reflowed onto copper pads through AEF have been achieved. A comparison was conducted between the microstructures of the lead-free
solder joints formed by the conventional thermal reflow and AEF reflow. Keeping the substrate temperature lower than that
of the solder bumps, AEF reflow successfully created metallurgical bonding between the lead-free solders and metallizations
through an interfacial intermetallic compound (IMC). The AEF reflow could be finished in several seconds, much faster than
the conventional hot-air reflow. Considering the morphology of the interfacial Cu6Sn5 IMC, a shorter heating time above the melting point would be a better choice for solder joint reliability. The results show
that AEF reflow is a promising localized heating soldering technique in electronic packaging. |
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| Keywords: | Lead-free alternating electromagnetic field (AEF) localized heating low-temperature bumping reflow IMC |
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