首页 | 本学科首页   官方微博 | 高级检索  
     

聚丙烯/石墨烯微片/碳化硅复合材料微观形态与导电导热性能研究
引用本文:蒋培松,张婧婧,徐子威,秦国锋. 聚丙烯/石墨烯微片/碳化硅复合材料微观形态与导电导热性能研究[J]. 塑料科技, 2020, 48(1): 42-46
作者姓名:蒋培松  张婧婧  徐子威  秦国锋
作者单位:广东工业大学材料与能源学院,广东 广州 510006
摘    要:采用熔融共混法制备聚丙烯/石墨烯微片/碳化硅(PP/GNP/SiC)复合材料,研究了SiC用量对PP/GNP/SiC复合材料的微观形态、结晶度和导电导热性能的影响。SEM与XRD测试结果表明,SiC粒子有助于提高拉伸力场对GNP的剥离效果以及GNP在PP基体中的分散程度,随着SiC粒子用量的增加,GNP的片径尺寸和片层厚度均减小,并与SiC粒子相互搭接。导电导热分析结果表明,随着SiC粒子用量的增加,PP/GNP/SiC复合材料的电导率先升高后降低,热导率逐渐提高。SiC用量为5%时,复合材料的电导率最高;SiC用量为20%时,复合材料的热导率最高。

关 键 词:聚丙烯  石墨烯微片  碳化硅  复合材料  微观形态  电导率  热导率

Study on Micromorphology and Electrical and Thermal Conductivity of PP/GNP/SiC Composites
JIANG Pei-song,ZHANG Jing-jing,XU Zi-wei,QIN Guo-feng. Study on Micromorphology and Electrical and Thermal Conductivity of PP/GNP/SiC Composites[J]. Plastics Science and Technology, 2020, 48(1): 42-46
Authors:JIANG Pei-song  ZHANG Jing-jing  XU Zi-wei  QIN Guo-feng
Affiliation:(School of Materials and Energy,Guangdong University of Technology,Guangzhou 510006,China)
Abstract:Polypropylene/graphene nanoplatelets/silicon carbide(PP/GNP/SiC) composites were prepared by melt blending method. The effects of SiC content on the morphology, crystallinity and electrical and thermal conductivity of PP/GNP/SiC composites were investigated. The SEM image and XRD test results show that SiC particles can improve the peeling effect of tensile force field on GNP and the dispersion degree of GNP in PP matrix. With the increase of SiC particle content, the grain size and thickness of GNP are both reduced and overlap with the SiC particles. The results of electrical and thermal conductivity analysis show that with the amount of SiC particles increases, the electrical conductivity of PP/GNP/SiC composites increases first and then decreases, and the thermal conductivity gradually increases. When the amount of SiC is 5%, the electrical conductivity of the composite is the highest;when the amount of SiC is 20%, the thermal conductivity of the composite is the highest.
Keywords:PP  GNP  SiC  Composite material  Microscopic morphology  Electrical conductivity  Thermal conductivity
本文献已被 CNKI 维普 万方数据 等数据库收录!
设为首页 | 免责声明 | 关于勤云 | 加入收藏

Copyright©北京勤云科技发展有限公司  京ICP备09084417号