| 低铅光亮Sn-Pb合金电镀工艺的研究 |
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| 引用本文： | 陈彦彬,刘庆国. 低铅光亮Sn-Pb合金电镀工艺的研究[J]. 电镀与精饰, 1999, 21(4): 12-14 |
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| 作者姓名： | 陈彦彬 刘庆国 |
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| 作者单位： | 北京科技大学固体电解质研究室,北京,100083 |
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| 摘 要： | 低铅含量的光亮Ｓｎ－Ｐｂ合金镀层不仅可避免晶须及锡的晶型转变现象，而且具有耐高温，低污染特性，因而具有较好的应用价值。研究了以柠檬酸和ＥＤＴＡ为络合剂的低铅光亮Ｓｎ－Ｐｂ合金龟镀工艺。
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| 关 键 词： | 电镀 Sn-Pb合金 柠檬酸 铅含量 |
| 修稿时间： | 1998-11-30 |
Research on Low Lead Content Bright Sn-Pb Alloy Electroplating Technology |
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| Chen Yanbin,Liu Qingguo. Research on Low Lead Content Bright Sn-Pb Alloy Electroplating Technology[J]. Plating & Finishing, 1999, 21(4): 12-14 |
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| Authors: | Chen Yanbin Liu Qingguo |
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| Abstract: | Electroplating technology of SnPb alloy in citric acidEDTA system was investigated. Effect of concentration of the salts and the complexing agents, cathodic current density and operating temperature on Pb content in the electroplate have been studied. Finally, the optimum bath compostion and technological conditions for electroplating bright SnPb alloy with about 10 wt% lead content have been determined. |
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| Keywords: | electroplating SnPb alloy citratric acid lead content |
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