|
|||||
|
|
Scratching by pad asperities in copper electrochemical-mechanical polishing |
|
| Affiliation: | [1]School of Mechatronics Engineering, Harbin Institute of Technology, Harbin 150001, China; [2]School of Civil Engineering, Harbin Institute of Technology, Harbin 150001, China |
| Abstract: | electrochemical-mechanical polishing scratch pad asperities nano-scratch model nano-indentation |
| Keywords: | electrochemical-mechanical polishing scratch pad asperities nano-scratch model nano-indentation |
| 本文献已被 CNKI 维普 等数据库收录！ | |