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Microstructure and properties of electronic packaging shell with high silicon carbide aluminum-base composites by semi-solid thixoforming |
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| Affiliation: | School of Materials Science and Engineering, University of Science and Technology Beijing, Beijing 100083, China |
| Abstract: | high silicon carbide aluminum-base composites electronic packaging semi-solid thixoforming thermal conductivity coefficient of thermal expansion |
| Keywords: | high silicon carbide aluminum-base composites electronic packaging semi-solid thixoforming thermal conductivity coefficient of thermal expansion |
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