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铜铅/钢双金属复合材料组织和粘结强度分析
引用本文:王立辉,唐荻,陈宇,许竹桃,张友登.铜铅/钢双金属复合材料组织和粘结强度分析[J].武汉冶金科技大学学报,2010(5):557-560.
作者姓名:王立辉  唐荻  陈宇  许竹桃  张友登
作者单位:[1]武汉钢铁集团公司研究院,湖北武汉430080 [2]北京科技大学高效轧制国家工程研究中心,北京100083
摘    要:采用双金属复合材料加工工艺制备铜铅/钢双金属复合材料,对复合材料金相组织、合金成分和界面处相组成进行分析,测定铜铅型轴瓦双金属复合材料的粘结强度。结果表明,专用钢背材料和铜铅合金复合,复合材料粘结强度σ为150 MPa;用08Al钢作钢背,复合材料粘结强度为85 MPa。不同钢背材料对双金属粘结强度产生不同影响,双金属界面金相组织观察和二次电子像结合能谱分析表明,铅均匀分布,未产生偏析现象,Fe原子和Cu原子互扩散而提高了双金属粘结强度。

关 键 词:铜铅合金  双金属  粘结强度  显微组织  扩散

Analysis of the microstructure and composite bond strength of bimetallic plates for Cu-Pb and steel
Authors:Wang Lihui  Tang Di  Chen Yu  Xu Zhutao  Zhang Youdeng
Affiliation:1.Research and Development Center,Wuhan Iron and Steel Group Corp.,Wuhan 430080,China;2.National Engineering Research Center for Advanced Rolling Technology,University of Science and Technology Beijing,Beijing 100083,China)
Abstract:The research studies the bond strength of the bimetallic plates of Cu-Pb steel.The experiments and their analysis show that the bond strength of the Cu-Pb bimetallic plates and the special steel is 105 MPa.And the bond strength of Cu-Pb plate and the 08Al steel is 55 MPa.In addition,the study shows that materials backed with different steel have obvious influence on the bond strength.And bimetallic interface analyses suggest that Pb does not present gravity segregation and the diffusion between Fe and Cu atoms increases the bond strength of bimetallic plates.
Keywords:Cu-Pb alloy  duplex metal  bond strength  microstructure  diffusion
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