| 电子电器环氧灌封材料的研究现状及发展趋势 |
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| 引用本文： | 郭艳宏. 电子电器环氧灌封材料的研究现状及发展趋势[J]. 化学工程师, 2002, 0(6): 44-46 |
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| 作者姓名： | 郭艳宏 |
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| 作者单位： | 哈尔滨工程大学,哈尔滨,150001 |
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| 摘 要： | 本文介绍了电子电器及其封装材料的相互关系，塑封材料的种类、环氧树脂的特性、国内外环氧灌封材料的现状和国内环氧灌封材料的发展趋势、需求情况以及亟待解决的问题。
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| 关 键 词： | 电子电器 环氧 灌封材料 |
| 文章编号： | 1002-1124(2002)06-0044-03 |
| 修稿时间： | 2002-10-30 |
Study and Development of Epoxy Potting Compound of Electiron Electrcal Equipment |
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| GUO Yan-hong. Study and Development of Epoxy Potting Compound of Electiron Electrcal Equipment[J]. Chemical Engineer, 2002, 0(6): 44-46 |
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| Authors: | GUO Yan-hong |
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| Affiliation: | Harbin Engineering University Harbin 150001 |
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| Abstract: | in the paper,described the relation of the electron,electrica equipment and potting compounds,the kinds of the plasticpotting compounds,the properties of epoxy resin potting compounds,development trend in home and abroad,dm and situation and Its impatient solved the questions. |
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| Keywords: | Electon electrcal equipment Epoxy Botting compound |
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