Studies of the mechanical and electrical properties of lead-free solder joints |
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Authors: | S K Kang W K Choi M J Yim D Y Shih |
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Affiliation: | (1) IBM T.J. Watson Research Center, 10598 Yorktown Heights, NY;(2) ACF Div., Telephus, Ltd., 305-343 Taejon, Korea |
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Abstract: | The mechanical and electrical properties of several Pb-free solder joints have been investigated including the interfacial
reactions, namely, the thickness and morphology of the intermetallic layers, which are correlated with the shear strength
of the solder joint as well as its electrical resistance. A model joint was made by joining two “L-shaped” copper coupons
with three Pb-free solders, Sn-3.5Ag (SA), Sn-3.8Ag-0.7Cu (SAC), and Sn-3.5Ag-3Bi (SAB) (all in wt.%), and combined with two
surface finishes, Cu and Ni(P)/Au. The thickness and morphology of the intermetallic compounds (IMCs) formed at the interface
were affected by solder composition, solder volume, and surface finish. The mechanical and electrical properties of Pb-free
solder joints were evaluated and correlated with their interfacial reactions. The microstructure of the solder joints was
also investigated to understand the electrical and mechanical characteristics of the Pb-free solder joints. |
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Keywords: | Pb-free solders solder joints intermetallic compounds morphology mechanical properties electrical properties Sn-Ag Sn-Ag-Cu Sn-Ag-Bi |
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