非晶合金凝固过程模拟与界面换热关系

为了准确模拟块体非晶合金凝固过程的温度场,对浇注温度为840℃的非晶合金凝固期间的温度场进行了数据采集.根据界面换热模型与热量守恒定律建立了液固相与铜模之间的界面换热关系式,从而实现了对非晶凝固温度场的模拟.结果表明,合金与铜模之间的界面换热系数随温度的增加而增大.合金在液态阶段降温曲线的模拟值与实测值基本吻合,且当凝固温度降至500℃后,二者偏差也较小.利用界面换热模型并结合实测温度场可以表征非晶合金凝固时的界面换热关系.

Simulation of solidification process of amorphous alloy and interfacial heat transfer relationship

In order to accurately simulate the temperature field of bulk amorphous alloy in the solidification process, the temperature field data of amorphous alloy during the solidification with the pouring temperature of 840 ℃ were collected. According to the interfacial heat transfer model and heat conservation law, the interfacial heat transfer coefficient relationship between the liquid-solid phases and copper mold was established, and the simulation of temperature field in the solidification process of amorphous alloy was realized. The results show that the interfacial heat transfer coefficient between the alloy and copper mold increases with increasing the temperature. The simulated value obtained from the cooling curves of the alloy melt is basically in agreement with the measured value. The deviation of both simulated and measured values is small when the solidification temperature reduces to about 500 ℃. The interfacial heat transfer model in combination with the measured temperature field can be used to characterize the interfacial heat transfer relationship of amorphous alloy during the solidification.