TaN-TiN binary alloys and superlattices as diffusion barriers for copper interconnects |
| |
Authors: | H Wang A Gupta Ashutosh Tiwari X Zhang J Narayan |
| |
Affiliation: | (1) Department of Materials Science and Engineering, North Carolina State University, 27695 Raleigh, NC;(2) Materials Science and Technology Division, Los Alamos National Laboratory, 87545 Los Alamos, NM |
| |
Abstract: | Binary alloys and superlattices of TaN-TiN thin films were grown on Si(100) substrates with a TiN buffer layer using pulsed
laser deposition. A special target assembly was used to manipulate the concentrations of these binary component films. The
60% TaN resulted in a TaN (3 nm)/TiN (2 nm) superlattice, while 30% and 70% TaN generated uniform TaxTi1−xN alloys. X-ray diffraction (XRD), transmission electron microscopy (TEM), and scanning transmission electron microscopy (STEM)
confirmed the single-crystalline nature of these films. Four-point probe resistivity measurements suggest that these alloy
and superlattice films have a lower resistivity than pure single-crystalline TaN films. The Cu-diffusion characteristic studies
showed that these materials would have the potential as high-temperature diffusion barriers for Cu in ultra-large-scale integration
technology. |
| |
Keywords: | TaN TiN superlattice alloy Cu diffusion barrier |
本文献已被 SpringerLink 等数据库收录! |