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氮化铝/氧化石墨烯对环氧树脂胶黏剂导热性能的影响
引用本文:肖强强,李莉,欧阳新平,袁文辉. 氮化铝/氧化石墨烯对环氧树脂胶黏剂导热性能的影响[J]. 精细化工, 2018, 35(10)
作者姓名:肖强强  李莉  欧阳新平  袁文辉
作者单位:华南理工大学化学与化工学院;华南理工大学环境与能源学院
基金项目:广东省自然科学基金(No. 2016A030313475);东莞市重大科技专项(No. 201521510201);广东省科技专项(No. 2015B010135009)
摘    要:使用硅烷偶联剂KH-560对氮化铝进行了表面改性,并以其为导热填料,环氧树脂为基体,制备了氮化铝/环氧树脂导热胶黏剂。采用FTIR、SEM、TG、热常数分析仪对导热胶黏剂进行了表征。结果表明:改性后硅烷偶联剂分子成功接枝在氮化铝表面。改性后,氮化铝与环氧树脂的界面粘结力增强,热稳定性和导热性均得到明显改善。当氮化铝质量为导热胶黏剂质量的70%时,改性氮化铝/环氧树脂热胶黏剂的导热系数为2.24W/(m·K),而未改性氮化铝/环氧树脂的导热系数仅为1.73W/(m·K)。为进一步提高其导热性能,制备了改性氮化铝/氧化石墨烯/环氧树脂导热胶黏剂,当改性氮化铝和氧化石墨烯的质量分数分别为50%和3%时,导热胶黏剂导热系数为3.05 W/(m·K)。

关 键 词:环氧树脂胶黏剂;氮化铝;氧化石墨烯;导热系数
收稿时间:2017-09-15
修稿时间:2018-01-09

Effects of Aluminium Nitride/Graphene Oxide on Thermal Conductivity of Epoxy Adhesive
Xiao Qiangqiang,Li Li,Ouyang Xinping and Yuan Wenhui. Effects of Aluminium Nitride/Graphene Oxide on Thermal Conductivity of Epoxy Adhesive[J]. Fine Chemicals, 2018, 35(10)
Authors:Xiao Qiangqiang  Li Li  Ouyang Xinping  Yuan Wenhui
Affiliation:School of Chemistry and Chemical Engineering, South China University of Technology,School of Environment and Energy, South China University of technology,School of Chemistry and Chemical Engineering, South China University of Technology,School of Chemistry and Chemical Engineering, South China University of Technology
Abstract:Aluminium nitride (AlN)/epoxy thermal conductive adhesive was prepared with epoxy as matrix material, AlN as thermal conductive filler. The structure and properties of adhesive were characterized using fourier transform infrared spectrometer, scanning electron microscopy, thermal gravimetric analyzer and thermal constants analyzer. The experimental results showed that coupling agent molecule was successfully chemically grafted onto the AlN surface. Modified AlN had strong interface adhesion with epoxy. The thermal stability and thermal conductivity of epoxy adhesive can be significantly improved by modified AlN. When the AlN mass fraction was 70%, the thermal conductivities of modified AlN/epoxy and AlN/epoxy adhesive were 2.24 W/(m.K) and 1.73 W/(m.K), respectively. In order to further improve thermal conductivity, hybrid filler of modified AlN and graphene oxide (GO) was employed to prepare thermal conductive adhesive. When the mass fractions of modified AlN and GO were 50% and 3%, the thermal conductivity of epoxy adhesive reached 3.05 W/(m.K).
Keywords:Epoxy adhesive   Aluminium Nitride   Graphene oxide   Thermal conductivity
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