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不流动性半固化片压合白斑的思考
引用本文:陈蓓,李志东.不流动性半固化片压合白斑的思考[J].印制电路信息,2008(10):44-47.
作者姓名:陈蓓  李志东
作者单位:广州市兴森电子有限公司,广东,广州,510730
摘    要:介绍了利用不流动性半固化片在制作刚挠板压合过程中产生白斑的原因,通过对不同条件下(不同敷形材料、表面不同线路图形分布、不同压合压力、不同半固化片张劐不流动性半固化片的压合实验发现,不流动性半固化片的压合与普通半固化片无论是从压合辅材、压合压力及压合模型上来说者研艮大不同。最后通过之前的实验分析,提出了不流动性半固化片的压舍模型。

关 键 词:刚挠板  不流动性半固化片  压合白斑

In Consideration of Lamination Crazing in No-flow Prepreg
CHEN Bei,LI Zhi-dong.In Consideration of Lamination Crazing in No-flow Prepreg[J].Printed Circuit Information,2008(10):44-47.
Authors:CHEN Bei  LI Zhi-dong
Affiliation:CHEN Bei LI Zhi-dong
Abstract:The article introduces the reason why lamination crazing are produced during the process of making rigid-flex print board with the use of no-flow prepreg. Through the lamination experiments on different conditions (different press pad material, different copper patterning, different lamination pressure, different amount of pieces of prepreg),it is found that the lamination of no-flow prepreg is very different from normal prepreg, such as lamination accessorial material, lamination pressure, and lamination model. Finally, from previous analysis of experiment data, a lamination model was brought forward.
Keywords:rigid-flex print board  no-flow prepreg  lamination crazing
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