On the formation of the diamond grain configuration during high temperature creep and fatigue

A study has been made of the influence of test variables on the formation of the diamond grain configuration during high temperature creep and fatigue deformation of a wide variety of metals. The proposed mechanisms for the formation of this interesting grain morphology are reviewed. It is concluded that the diamond grain configuration arises from a balance between grain-boundary sliding, grain-boundary mobility, intragranular deformation and defect imbalance across the grain boundaries and that it tends to be stabilized by intergranular cavitation. While the phenomenon occurs during high temperature fatigue in a variety of metals irrespective of their crystal structure, during creep it has been observed only in to h c p metals. It is surmised that the occurrence of the diamond array of grain boundaries during creep deformation in h c p metals is aided by the limited number of slip systems which leads to high defect imbalances in adjacent grains and consequently high driving forces for grain-boundary migration. On the basis of quantitative metallography involving measurements of the number of edges per grain section, the number of grains meeting at vertices, angular distribution histograms and grain-boundary lengths in different angular orientations with respect to the stress axis in "annealed" and "diamond" microstructures, it is concluded that the shape of the "diamond" grain is essentially the same as that of the "annealed" grain but in a distorted form.