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Creep behavior and microstructure evolution of directionally solidified superalloy IC 10 at high temperature
引用本文:赵希宏 孙跃军 黄朝辉 宫声凯 徐惠彬. Creep behavior and microstructure evolution of directionally solidified superalloy IC 10 at high temperature[J]. 中国有色金属学会会刊, 2006, 16(A02): 122-126
作者姓名:赵希宏 孙跃军 黄朝辉 宫声凯 徐惠彬
作者单位:[1]School of Materials Science and Engineering, Beijing University of Aeronautics and Astronautics, Beijing 100083, China [2]Beijing Institute of Aeronautical Materials, Beijing 100095, China
摘    要:The creep behavior of directionally solidified (DS) superalloy IC 10 was investigated under 192 MPa and 218 MPa at 980 ℃. Under the testing conditions, the marked creep characteristic of the superalloy is that the creep curve has a short primary and secondary stage and a long tertiary stage. Another creep characteristic is that the superalloy has excellent plasticity at high temperature. To study the creep behavior, the microstructure was observed by SEM and TEM. Different from other microstructure of Ni-base superalloys, superalloy IC10 forms incompletely rafted γ' phase during the creep processes. To understand the creep deformation mechanism of superalloy IC10, the movement of dislocations was analyzed. The results show that the dislocations moving in the γ matrix and climbing over the γ' precipitates is the main deformation mechanism under the experimental conditions.

关 键 词:蠕变行为 高温合金 IC10 显微结构 位错 定向凝固 超耐热合金
收稿时间:2006-04-20
修稿时间:2006-06-30

Creep behavior and microstructure evolution of directionally solidified superalloy IC 10 at high temperature
ZHAO Xi-hong, SUN Yue-jun, HUANG Zhao-hui, GONG Sheng-kai, XU Hui-bin. Creep behavior and microstructure evolution of directionally solidified superalloy IC 10 at high temperature[J]. Transactions of Nonferrous Metals Society of China, 2006, 16(A02): 122-126
Authors:ZHAO Xi-hong   SUN Yue-jun   HUANG Zhao-hui   GONG Sheng-kai   XU Hui-bin
Abstract:
Keywords:superalloy IC 10   creep   microstructure evolution   directional solidification   dislocation   plasticity
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