| 降低阳极连接中残余应力的措施 |
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| 引用本文： | 刘子建,刘翠荣,孟庆森.降低阳极连接中残余应力的措施[J].铝加工,2007(4):46-48. |
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| 作者姓名： | 刘子建 刘翠荣 孟庆森 |
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| 作者单位： | 太原科技大学,山西,太原,030024;太原理工大学,山西,太原,030024 |
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| 摘 要： | 简要介绍了阳极连接的机理、应用范围、残余应力的存在对键合质量的影响，分析了残余应力产生的因素，提出了降低这些因素影响的措施。
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| 关 键 词： | 残余应力 金属厚度 热膨胀系数 温度 冷却速度 |
| 文章编号： | 1005-4898（2007）04-0046-03 |
| 收稿时间： | 2007-04-14 |
| 修稿时间： | 2007年4月14日 |
Measures of Lowing Residual Stress in Anodic Bonding |
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| LIU Zi-jian,LIU Cui-rong,MENG Qing-sen.Measures of Lowing Residual Stress in Anodic Bonding[J].Aluminium Fabrication,2007(4):46-48. |
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| Authors: | LIU Zi-jian LIU Cui-rong MENG Qing-sen |
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| Affiliation: | 1. Taiyuan University of Science and Technology, Taiyuan 030024, China; 2. Taiyuan University of science and Engineering, Taiyuan 030024, China |
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| Abstract: | The mechanism of anodic bonding, application area and the effect of residual stress were introduced in the paper, andthe corresponding measures were also put forward to decrease the residual stress in anodic bonding. |
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| Keywords: | residual stress metal thickness coefficient of thermal expansion temperature cooling speed |
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