| 多层挠性板 |
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| 引用本文： | 蔡积庆. 多层挠性板[J]. 印制电路信息, 2004, 20(9): 43-46 |
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| 作者姓名： | 蔡积庆 |
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| 摘 要： | 概述了多层挠性板,它适用于要求小型、轻量、薄型、高性能和高密度安装的携带电子机器。
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| 关 键 词： | 多层挠性板 挠性积层板 挠性板 |
Multilayer Flexible Board |
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| Cai Jiqing. Multilayer Flexible Board[J]. Printed Circuit Information, 2004, 20(9): 43-46 |
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| Authors: | Cai Jiqing |
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| Abstract: | This paper describes the characteristic of multilayer flexible printed circuit (FPC). They are suitable to the mobile electronic machines requiring miniaturization weightlessness, thinness and high performance. |
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| Keywords: | multilayer flexible board flex build board flex board |
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