电器封装用高效导热/阻燃环氧复合材料的制备

目的为了提高电器封装材料的安全性,制备出一种具有高效导热/阻燃的环氧复合材料。方法通过原位聚合法,采用三聚氰胺-甲醛树脂预聚体(MF)修饰石墨烯(G)/磷烯(BP)合成纳米填料,辅以环氧树脂(E51)制备高导热/阻燃的环氧复合材料。通过TGA、热线法和锥形量热法分别测试复合材料的热稳定性、导热性和阻燃性。结果研究结果表明,当MF@BP/G的质量分数为3%时,环氧复合材料的残碳量高达22.19%,相较于纯的环氧复合材料提升了76.77%;导热系数提升至0.257 W/(m?K),提升率为27.86%;峰值热释放率、总的热释放量、峰值烟雾释放率和总的烟雾释放量分别下降了43.76%,27.72%,46.81%和28.83%。结论以MF@BP/G为功能填料,可以有效提高环氧复合材料的导热性和阻燃性,有利于提升环氧复合材料的使用安全性。

Preparation of Epoxy Composites with Highly Efficient Thermal Conductivity/Flame Retardancy for Electrical Packaging

The work aims to improve the safety of electrical packaging materials and prepare an epoxy composite with highly efficient thermal conductivity and flame retardancy.Melamine-formaldehyde resin prepolymer(MF)was employed to modify graphene(G)/blackphosphorene(BP)to synthesize nano-filler via in-situ polymerization,and then epoxy composites with high thermal conductivity/flame retardancy were prepared with the supplement of E51.The thermal stability,thermal conductivity and flame retardancy of the composites were tested by TGA,hot wire method and cone calorimetry,respectively.The research results showed that,when the mass fraction of MF@BP/G was 3%,the residual charring rate of epoxy composites was as high as 22.19%,which was an increase of 76.77%compared with pure epoxy composites;the thermal conductivity was increased to 0.257 W/(m?K),and the increase rate was 27.86%;and the peak heat release rate,the total heat release,the peak smoke release rate and total smoke release decreased by 43.76%,27.72%,46.81%and 28.83%,respectively.MF@BP/G used as a functional filler can effectively improve the thermal conductivity and flame retardancy of epoxy composites,and is conducive to improving the use safety of epoxy composites.