| 无铅SAC0307焊料润湿性与漫流性集成测试 |
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| 引用本文： | 甘贵生,刘聪,程翰林,明忠正,高颢洋.无铅SAC0307焊料润湿性与漫流性集成测试[J].电子元件与材料,2020(2):83-88,94. |
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| 作者姓名： | 甘贵生 刘聪 程翰林 明忠正 高颢洋 |
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| 作者单位： | ;1.重庆理工大学材料科学与工程学院;2.重庆理工大学特种焊接材料与技术重庆市高校工程研究中心 |
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| 基金项目： | 国家自然科学基金面上项目(61774066);重庆市重点产业共性关键技术创新专项(cstc2016zdcy-ztzx0047,cstc2016zdcy-ztzx0036);重庆理工大学实验技术开发基金项目(SK201708);重庆理工大学2018科研立项(KLA18001);2018年大学生创新创业训练计划项目立项(2018CX024);重庆市教委科学技术研究项目(KJQN201803701) |
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| 摘 要： | 为节省测试时间并降低测试成本,通过测量SAC0307焊料对铜管的润湿力、爬升高度及焊料对铜片的润湿力和铺展率,建立润湿性和漫流性的对应关系,集成测试获得焊料对铜片的润湿性能和铺展能力。结果表明,松香助焊剂作用下焊料对铜片的润湿力为铜管的1.1倍,丁二酸助焊剂作用下焊料对铜片的润湿力是铜管的1.3倍,松香和丁二酸两种助焊剂作用下焊料在铜管内爬升高度与铜片上铺展率的关系都为指数关系。
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| 关 键 词： | 无铅焊料 润湿性 漫流性 集成测试 |
Integrated test of wettability and fluidity of lead-free SAC0307 solder |
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| GAN Guisheng,LIU Cong,CHENG Hanlin,MING Zhongzhen,GAO Haoyang.Integrated test of wettability and fluidity of lead-free SAC0307 solder[J].Electronic Components & Materials,2020(2):83-88,94. |
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| Authors: | GAN Guisheng LIU Cong CHENG Hanlin MING Zhongzhen GAO Haoyang |
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| Affiliation: | (School of Materials Science and Engineering,Chongqing University of Technology,Chongqing 400054,China;Chongqing University Engineering Research Center for Special Welding Materials and Technology,Chongqing University of Technology,Chongqing 400054,China) |
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| Abstract: | To save examination time and cost,the wetting force and climbing of SAC0307 solder on copper tube and wetting force,wetting time and spreading rate of solder on copper sheet were measured.The wettability-spreading ability relation of the solder on copper sheet were then established by the integrated measurement.The results show that the wetting force of the copper sheet under rosin flux is 1.1 times larger than that of the copper tube,which is 1.3 times larger under succinic acid flux.Under the action of rosin and succinic acid flux,the copper pipe climbing height and spreading rate are exponentially dependent. |
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| Keywords: | solder wettability spreadability integration test |
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